AM263P4 datasheet(150/168 Pages) TI2

150 / 168 page

8 Applications, Implementation, and Layout

Note

Information in the following applications sections is not part of the TI component specification,

and TI does not warrant its accuracy or completeness. TI’s customers are responsible for

determining suitability of components for their purposes, as well as validating and testing their design

implementation to confirm system functionality.

8.1 Device Connection and Layout Fundamentals

8.1.1 External Oscillator

For more information about External Oscillators, see the Input Clocks / Oscillators section.

8.1.2 JTAG, EMU, and TRACE

Texas Instruments supports a variety of eXtended Development System (XDS) JTAG controllers with various

debug capabilities beyond only JTAG support. A summary of this information is available in the XDS Target

Connection Guide.

For recommendations on JTAG, EMU, and TRACE routing, see the Emulation and Trace Headers Technical

Reference Manual

8.1.3 OSPI Connections for Flash-in-Package (ZCZ_F)

The ZCZ_F packages offers an internally connected on-die OSPI flash module (ISSI IS25LX064-JWLA3 OSPI

Flash device). Due to the internal connections, the ZCZ_F package comes with additional pin connection

requirements. Please reference Pin Connectivity Requirements for pin connectivity requirements and ball

names.

• The OSPI_D2 signal of Flash die (pin L1-OSPI0_ZCZ_F_WP) doubles as the active low Write Protect input

for the internally connected flash device. Therefore, pin L1-OSPI0_ZCZ_F_WP must be connected to the

relevant source (VDDS33) through a separate 4.7kΩ external pull resistor. This resistor must be placed as

close to the device as possible.

• The OSPI_RESET_OUT0 signal of Flash die (pin J3-OSPI0_ZCZ_F_RESET_OUT0) must be connected to

an open-drain equivalent of PORz or WARMRSTn in order to reset the on-die OSPI flash module. The open-

drain requirement is to prevent a bus contention between the external PORz or WARMRSTn connection via

pin J3-OSPI0_ZCZ_F_RESET_OUT0 and the package internal connection between the AM263P and the

OSPI flash device.

• The remaining pins internally connected for the on-die OSPI flash module should be left unconnected with no

PCB traces:

– H1

– J1

– J4

– K2

– K3

– K4

– L2

– M1

– M4

– P1

– P3

Pleased see ZCZ_F Package OSPI Connection Requirements for a visualization of the necessary connections.

AM263P4, AM263P2, AM263P4-Q1, AM263P2-Q1

SPRSP81D – OCTOBER 2023 – REVISED MAY 2025

www.ti.com

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