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STM32F101X6 数据表(PDF) 71 Page - STMicroelectronics |
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STM32F101X6 数据表(HTML) 71 Page - STMicroelectronics |
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71 / 74 page ![]() STM32F101xx Revision history 71/74 18-Oct-2007 3 VESD(CDM) value added to Table 31: ESD absolute maximum ratings. Note added below Table 9: Embedded reset and power control block characteristics. and below Table 21: HSE 4-16 MHz oscillator characteristics. Note added below Table 34: Output voltage characteristics and VOH parameter description modified. Table 41: ADC characteristics and Table 43: ADC accuracy - limited test conditions modified. Figure 27: ADC accuracy characteristics modified. Packages are ECOPACK® compliant. Tables modified in Section 5.3.5: Supply current characteristics. ADC and ANTI_TAMPER signal names modified (see Table 3: Pin definitions). Table 3: Pin definitions modified. Note 4 removed and values updated in Table 17: Typical current consumption in Standby mode. Vhys modified in Table 33: I/O static characteristics. Updated: Table 29: EMS characteristics and Table 30: EMI characteristics. tVDD modified in Table 8: Operating conditions at power-up / power-down. Typical values modified, note 2 modified and note 3 removed in Table 25: Low-power mode wakeup timings. Maximum current consumption Table 11, Table 12 and Table 13 updated. Values added and notes added in Table 14: Typical and maximum current consumptions in Stop and Standby modes. On-chip peripheral current consumption on page 38 added. Package mechanical data inch values are calculated from mm and rounded to 4 decimal digits (see Section 6: Package characteristics). Vprog added to Table 27: Flash memory characteristics. TS_temp added to Table 45: TS characteristics. TS_vrefint added to Table 10: Embedded internal reference voltage. Handling of unused pins specified in General input/output characteristics on page 48. All I/Os are CMOS and TTL compliant. Table 3: Pin definitions: table clarified and Note 7 modified. Internal LSI RC frequency changed from 32 to 40 kHz (see Table 24: LSI oscillator characteristics). Values added to Table 25: Low-power mode wakeup timings. NEND modified in Table 28: Flash memory endurance and data retention. Option byte addresses corrected in Figure 7: Memory map. ACCHSI modified in Table 23: HSI oscillator characteristics. tJITTER removed from Table 26: PLL characteristics. Appendix A: Important notes on page 71 added. Added: Figure 12, Figure 13, Figure 14 and Figure 16. Table 52. Document revision history (continued) Date Revision Changes |
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