ADP2116ACPZ-R7 datasheet(36/36 Pages) AD

36 / 36 page

ADP2116

Rev. 0 | Page 36 of 36

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2

0.30

0.23

0.18

0.20 REF

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

12° MAX

1.00

0.85

0.80

SEATING

PLANE

COPLANARITY

0.08

0.50

0.40

0.30

3.50 REF

0.50

BSC

PIN 1

INDICATOR

TOP

VIEW

5.00

BSC SQ

4.75

BSC SQ

3.25

3.10 SQ

2.95

PIN 1

INDICATOR

0.60 MAX

0.25 MIN

EXPOSED

PAD

(BOTTOM VIEW)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 77. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

5 mm × 5 mm Body, Very Thin Quad

(CP-32-2)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range1

Package Description

Package Option

Ordering Quantity

ADP2116ACPZ-R72

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-32-2

1,500

ADP2116-EVALZ2

Evaluation Board

1 Operating junction temperature is −40°C to +125°C.

2 Z = RoHS Compliant Part.

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D08436-0-10/09(0)

ADP2116ACPZ-R7 数据表(PDF) 36 Page - Analog Devices

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