| 数据搜索系统,热门电子元器件搜索 |
|
MPC8572ECLPXATLD 数据表(PDF) 100 Page - Freescale Semiconductor, Inc |
|
|
|||||||||||||||||||||||||||||
MPC8572ECLPXATLD 数据表(HTML) 100 Page - Freescale Semiconductor, Inc |
|
100 / 140 page ![]() MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 4 100 Freescale Semiconductor Package Description 18 Package Description This section describes package parameters, pin assignments, and dimensions. 18.1 Package Parameters for the MPC8572E FC-PBGA The package parameters are as provided in the following list. The package type is 33 mm × 33 mm, 1023 flip chip plastic ball grid array (FC-PBGA). Package outline 33 mm × 33 mm Interconnects 1023 Ball Pitch 1 mm Ball Diameter (Typical) 0.6 mm Solder Balls 63% Sn 37% Pb Solder Balls (Lead-Free) 96.5% Sn 3.5% Ag |
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |