L6460 datasheet(13/139 Pages) STMICROELECTRONICS

13 / 139 page

L6460

General description

Doc ID 17713 Rev 1

13/139

GPIO12

General purpose I/O

Analog In/Out - CMOS bi-dir

GPIO13

General purpose I/O

Analog In/Out - CMOS bi-dir

GPIO14

General purpose I/O

Analog In/Out - CMOS bi-dir

N.C.

Not connected

DC4_MINUS Bridge 4 phase “minus” output

Output

DC4_SENSE Bridge 4 sense output(4)

Output

DC3_SENSE Bridge 3 sense output(4)

Output

DC3_MINUS Bridge 3 phase “minus” output

Output

N.C.

Not connected

GPIO11

General purpose I/O

Analog In/Out - CMOS bi-dir

GPIO10

General purpose I/O

Analog In/Out - CMOS bi-dir

GPIO9

General purpose I/O

Analog In/Out - CMOS bi-dir

GPIO5

General purpose I/O

Analog In/Out - CMOS bi-dir

DC3_SENSE Bridge 3 sense output(4)

Output

N.C.

Not connected

DC3_PLUS

Bridge 3 phase “plus” output

Output

VSupply

Main voltage supply

Power input

nRESET

Open drain system reset pin

CMOS Input/output

V3v3

Internal 3.3 volt regulator

Power Input/output

VSupplyInt

Internal voltage supply

Power Input

GPIO7

General purpose I/O

Analog In/Out - CMOS bi-dir

VGPIO_SPI

Low voltage pins power supply

Power input

GPIO6

General purpose I/O

Analog In/Out - CMOS bi-dir

VSWDRV_SW Switching regulator controller source input

Power input

VSWDRV_GATE Switching driver gate drive pin

Analog output

VPump

Charge pump voltage

Power Input/output

CPH

Charge pump high switch pin

Power Input/output

CPL

Charge pump low switch pin

Power Input/output

VSupply

Main voltage supply

Power input

DC1_plus

Bridge 1 phase “plus” output

Output

E_Pad

GND_PAD

(1)(2)(3)

These pins must be connected all together to a unique PCB ground.

Bridges1 and 2 have 2 ground pads: one is bonded to the relative ground pin (GND1 or GND2) and the

other is connected to exposed pad (E_Pad) ground ring. This makes the bond wires testing possible by

forcing a current between E-Pad and GND1 or GND2 pins and using the other pin as sense pin to measure

the resistance of E-Pad bonding. (N.B: grounds of two bridges are internally connected together).

The analog ground is connected to exposed pad E-Pad.

The pin must be tied to ground if bridge is not used as a stepper motor.

Table 2.

Pins configuration (continued)

Pin #

Pin name

Description

Type

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