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MPC5643L 数据表(PDF) 22 Page - Freescale Semiconductor, Inc |
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MPC5643L 数据表(HTML) 22 Page - Freescale Semiconductor, Inc |
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22 / 136 page ![]() MPC5643L Microcontroller Data Sheet, Rev. 8.1 Introduction Freescale Semiconductor 22 • Single high supply required: nominal 3.3 V both for packaged and Known Good Die option — Packaged option requires external ballast transistor due to reduced dissipation capacity at high temperature but can use embedded transistor if power dissipation is maintained within package dissipation capacity (lower frequency of operation) — Known Good Die option uses embedded ballast transistor as dissipation capacity is increased to reduce system cost • All I/Os are at same voltage as external supply (3.3 V nominal) • Duplicated Low-Voltage Detectors (LVD) to guarantee proper operation at all stages (reset, configuration, normal operation) and, to maximize safety coverage, one LVD can be tested while the other operates (on-line self-testing feature) 1.5.41 Built-In Self-Test (BIST) capability This device includes the following protection against latent faults: • Boot-time Memory Built-In Self-Test (MBIST) • Boot-time scan-based Logic Built-In Self-Test (LBIST) • Run-time ADC Built-In Self-Test (BIST) • Run-time Built-In Self Test of LVDs |
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