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MPC5643L 数据表(PDF) 79 Page - Freescale Semiconductor, Inc |
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MPC5643L 数据表(HTML) 79 Page - Freescale Semiconductor, Inc |
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79 / 136 page  Electrical characteristics MPC5643L Microcontroller Data Sheet, Rev. 8.1 Freescale Semiconductor 79 Table 11. Thermal characteristics for 144 LQFP package1 1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. Symbol Parameter Conditions Value Unit RJA D Thermal resistance, junction-to-ambient natural convection2 2 Junction-to-Ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board meets JEDEC specification for this package. Single layer board – 1s 44 °C/W Four layer board – 2s2p 36 RJMA D Thermal resistance, junction-to-ambient forced convection at 200 ft/min Single layer board – 1s 35 °C/W Four layer board – 2s2p 30 RJB D Thermal resistance junction-to-board3 3 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC specification for the specified package. —24 °C/W RJC D Thermal resistance junction-to-case4 4 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer. —8 °C/W JT D Junction-to-package-top natural convection5 5 Thermal characterization parameter indicating the temperature difference between the package top and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT. —2 °C/W Table 12. Thermal characteristics for 257 MAPBGA package1 1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. Symbol Parameter Conditions Value Unit RJA D Thermal resistance junction-to-ambient natural convection2 2 Junction-to-Ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board meets JEDEC specification for this package. Single layer board – 1s 46 °C/W Four layer board – 2s2p 26 RJMA D Thermal resistance, junction-to-ambient forced convection at 200 ft/min Single layer board – 1s 37 °C/W Four layer board – 2s2p 22 RJB D Thermal resistance junction-to-board3 3 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC specification for the specified package. —13 °C/W RJC D Thermal resistance junction-to-case4 4 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer. —8 °C/W JT D Junction-to-package-top natural convection5 5 Thermal characterization parameter indicating the temperature difference between the package top and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT. —2 °C/W |
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