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WM8953ECS/RV 数据表(PDF) 99 Page - Wolfson Microelectronics plc |
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WM8953ECS/RV 数据表(HTML) 99 Page - Wolfson Microelectronics plc |
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99 / 100 page ![]() Production Data WM8953 w PD, January 2009, Rev 4.0 99 PACKAGE DIMENSIONS DM049.C B: 42 BALL W-CSP PACKAGE 3.226 X 3.440 X 0.7mm BODY, 0.50 mm BALL PITCH A1 CORNER TOP VIEW E Z 0.10 2 X D 5 4 DETAIL 2 DETAIL 2 A A2 2 Z 0.10 2 X A1 Z bbb Z 1 SOLDER BALL E1 A D1 DETAIL 1 D C B G F E e e BOTTOM VIEW 1 65 4 3 2 6 f f G h NOTES: 1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. 2. THIS DIMENSION INCLUDES STAND-OFF HEIGHT ‘A1’ AND BACKSIDE COATING. 3. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE. 4. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY. 5. ‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH. 6. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE. 7. FOLLOWS JEDEC DESIGN GUIDE MO-211-C. A1 0.225 D D1 E E1 e 2.500 BSC 3.440 BSC 0.060 BSC 3.00 BSC 0.50 BSC 3.226 BSC Dimensions (mm) Symbols MIN NOM MAX NOTE A 0.7 A2 0.355 0.380 0.405 5 f 0.785 0.615 0.250 0.275 g 0.070 0.035 0.105 h 0.315 BSC |
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