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M95128-RMB6TG 数据表(PDF) 44 Page - STMicroelectronics |
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M95128-RMB6TG 数据表(HTML) 44 Page - STMicroelectronics |
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44 / 49 page ![]() Package mechanical data M95128-W M95128-R M95128-DF 44/49 Doc ID 5798 Rev 16 Figure 25. UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat no lead, package outline 1. Drawing is not to scale. 2. The central pad (area E2 by D2 in the above illustration) is internally pulled to VSS. It must not be connected to any other voltage or signal line on the PCB, for example during the soldering process. Table 24. UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead 2 x 3 mm, data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to four decimal digits. Typ Min Max Typ Min Max A 0.550 0.450 0.600 0.0217 0.0177 0.0236 A1 0.020 0.000 0.050 0.0008 0.0000 0.0020 b 0.250 0.200 0.300 0.0098 0.0079 0.0118 D 2.000 1.900 2.100 0.0787 0.0748 0.0827 D2 (rev MC) 1.200 1.600 0.0472 0.0630 E 3.000 2.900 3.100 0.1181 0.1142 0.1220 E2 (rev MC) 1.200 1.600 0.0472 0.0630 e 0.500 0.0197 K (rev MC) 0.300 0.0118 L 0.300 0.500 0.0118 0.0197 L1 0.150 0.0059 L3 0.300 0.0118 eee(2) 2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from measuring. 0.080 0.0031 |
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