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W25Q40BLSVIP 数据表(PDF) 69 Page - Winbond |
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W25Q40BLSVIP 数据表(HTML) 69 Page - Winbond |
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69 / 74 page  W25Q40BL Publication Release Date: May 04, 2012 - 69 - Revision D 8-Pad WSON 6x5-mm Cont’d. SYMBOL MILLIMETERS INCHES Min Nom Max Min Nom Max SOLDER PATTERN M 3.40 0.134 N 4.30 0.169 P 6.00 0.236 Q 0.50 0.020 R 0.75 0.026 Notes: 1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications. 2. BSC = Basic lead spacing between centers. 3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package. 4. It is recommended to connect the metal pad area on the bottom center of the package to the device ground (GND pin). Avoid placement of exposed PCB vias under the pad. |
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