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STM32F103RG 数据表(PDF) 58 Page - STMicroelectronics |
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STM32F103RG 数据表(HTML) 58 Page - STMicroelectronics |
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58 / 120 page ![]() Electrical characteristics STM32F103xF, STM32F103xG 58/120 Doc ID 16554 Rev 3 Figure 21. Typical application with a 32.768 kHz crystal 5.3.7 Internal clock source characteristics The parameters given in Table 25 are derived from tests performed under ambient temperature and VDD supply voltage conditions summarized in Table 10. High-speed internal (HSI) RC oscillator ai14146 OSC32_OU T OSC32_IN fLSE CL1 RF STM32F103xx 32.768 kH z resonator CL2 Resonator with integrated capacitors Bias controlled gain Table 25. HSI oscillator characteristics(1) 1. VDD = 3.3 V, TA = –40 to 105 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit fHSI Frequency - 8 MHz DuCy(HSI) Duty cycle 45 - 55 % ACCHSI Accuracy of the HSI oscillator User-trimmed with the RCC_CR register(2) 2. Refer to application note AN2868 “STM32F10xxx internal RC oscillator (HSI) calibration” available from the ST website www.st.com. -- 1(3) 3. Guaranteed by design, not tested in production. % Factory- calibrated(4) 4. Based on characterization, not tested in production. TA = –40 to 105 °C –2 - 2.5 % TA = –10 to 85 °C –1.5 - 2.2 % TA = 0 to 70 °C –1.3 - 2 % TA = 25 °C –1.1 - 1.8 % tsu(HSI) (4) HSI oscillator startup time 1-2 µs IDD(HSI) (4) HSI oscillator power consumption - 80 100 µA |
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