STM32F103RG datasheet(11/120 Pages) STMICROELECTRONICS

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STM32F103xF, STM32F103xG

Description

Doc ID 16554 Rev 3

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2.1

Device overview

The STM32F103xx XL-density performance line family offers devices in four different

package types: from 64 pins to 144 pins. Depending on the device chosen, different sets of

peripherals are included, the description below gives an overview of the complete range of

peripherals proposed in this family.

Figure 1 shows the general block diagram of the device family.

Table 2.

STM32F103xF and STM32F103xG features and peripheral counts

Peripherals

STM32F103Rx

STM32F103Vx

STM32F103Zx

Flash memory

768 KB

1 MB

768 KB

1 MB

768 KB

1 MB

SRAM in Kbytes

FSMC

Yes(1)

For the LQFP100 package, only FSMC Bank1 and Bank2 are available. Bank1 can only support a

multiplexed NOR/PSRAM memory using the NE1 Chip Select. Bank2 can only support a 16- or 8-bit NAND

Flash memory using the NCE2 Chip Select. The interrupt line cannot be used since Port G is not available

in this package.

Yes

Timers

General-purpose

Advanced-control

Basic

Comm

SPI(I2S)(2)

The SPI2 and SPI3 interfaces give the flexibility to work in an exclusive way in either the SPI mode or the

I2S audio mode.

3(2)

I2C2

USART

USB

CAN

SDIO

GPIOs

112

12-bit ADC

Number of channels

12-bit DAC

Number of channels

CPU frequency

72 MHz

Operating voltage

2.0 to 3.6 V

Operating temperatures

Ambient temperatures: –40 to +85 °C /–40 to +105 °C (see Table 10)

Junction temperature: –40 to + 125 °C (see Table 10)

Package

LQFP64

LQFP100

LQFP144, BGA144

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