www.ams.com/AS8510

Revision 3.5

6 - 46

AS8510

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only. Functional operation of the

device at these or any other conditions beyond those indicated in Electrical Characteristics on page 7 is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Notes

Electrical Parameters

DC supply voltage (AVDD and DVDD)

-0.3

5

V

AVDD + 0.3

DVDD + 0.3

V

Input current (latchup immunity)

-100

100

mA

AEC - Q100 - 004

Electrostatic Discharge

Electrostatic discharge (ESD) all pins

±2

kV

AEC - Q100 - 002

Continuous Power Dissipation

Total power dissipation

50

mW

SSOP20 in still air, soldered on JEDEC

standard board @ 125º ambient, static

operation with no time limit

Temperature Ranges and Storage Conditions

-50

125

ºC

ºC

80

K/W

JEDEC standard test board, 0 air velocity

260

ºC

Norm: IPC/JEDEC J-STD-020

The reflow peak soldering temperature (body

temperature) is specified according IPC/

JEDEC J-STD-020 “Moisture/Reflow Sensitivity

Classification for Nonhermetic Solid State

Surface Mount Devices”.

The lead finish for Pb-free leaded packages is

matte tin (100% Sn).

Humidity non-condensing

5

85

%