CMX608 datasheet(69/70 Pages) CMLMICRO

69 / 70 page

RALCWI Vocoder

CMX608/CMX618/CMX638

 2014 CML Microsystems Plc

D/608_18_38/11

Depending on the method of lead termination at the edge of the package, pull back (L1) may be present.

L minus L1 to be equal to, or greater than 0.3mm

The underside of the package has an exposed metal pad which should ideally be soldered to the pcb to enhance the thermal

conductivity and mechanical strength of the package fixing. Where advised, an electrical connection to this metal pad may also

be required

TYP.

MAX.

MIN.

DIM.

1.00

0.80

0.05

0.30

0.00

0.18

7.00 BSC

NOTE :

All dimensions in mm

Angles are in degrees

A & B are reference data and do

not include mold deflash or protrusions.

5.65

4.60

5.65

4.60

0.50

0.30

Index Area 1

Dot

Index Area 2

Dot

Chamfer

Index Area 1 is located directly above Index Area 2

0.50

0.20

0.15

Exposed

Metal Pad

0.20

0.90

0.25

0.40

Figure 23 48-pin VQFN Mechanical Outline (Q3)

Order as part no. CMX608/CMX618/CMX638Q3

As package dimensions may change after publication of this datasheet, it is recommended that you check

for the latest Packaging Information from the Datasheets page of the CML website:

[http://www.cmlmicro.com/].

CMX608 数据表(PDF) 69 Page - CML Microcircuits

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