PIC16LC554 datasheet(79/96 Pages) MICROCHIP

79 / 96 page

Preliminary

DS40143B-page 79

PIC16C55X(A)

11.0

PACKAGING INFORMATION

Ceramic CERDIP Dual In-Line Family

Notes:

Controlling parameter: inches.

Parameter “e1” (“e”) is non-cumulative.

Seating plane (standoff) is deﬁned by board hole size.

Parameter “B1” is nominal.

Symbol List for Ceramic CERDIP Dual In-Line Package Parameters

Symbol

Description of Parameters

Angular spacing between min. and max. lead positions measured at the gauge plane

Distance between seating plane to highest point of body (lid)

Distance between seating plane and base plane

Distance from base plane to highest point of body (lid)

Base body thickness

Width of terminal leads

Width of terminal lead shoulder which locate seating plane (standoff geometry optional)

Thickness of terminal leads

Largest overall package parameter of length

Body width parameters not including leads

Largest overall package width parameter outside of lead

Body width parameter - end lead center to end lead center

Linear spacing of true minimum lead position center line to center line

Linear spacing between true lead position outside of lead to outside of lead

Linear spacing between center lines of body standoffs (terminal leads)

Distance from seating plane to end of lead

Total number of potentially usable lead positions

Distance from true position center line of Number 1 lead to the extremity of the body

Distance from other end lead edge positions to the extremity of the body

PIC16LC554 数据表(PDF) 79 Page - Microchip Technology