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PIC16F84A 数据表(PDF) 55 Page - Microchip Technology |
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PIC16F84A 数据表(HTML) 55 Page - Microchip Technology |
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55 / 68 page ![]() PIC16F84A © 1998 Microchip Technology Inc. Preliminary DS35007A-page 55 11.0 PACKAGING INFORMATION 11.1 Package Marking Information 18L PDIP XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX AABBCDE AABBCDE XXXXXXXXXXXX XXXXXXXXXXXX 18L SOIC Example PIC16F84A-04I/P 9832SAW XXXXXXXXXXXX 9848SAN /SO PIC16F84A-04 Example AABBCDE XXXXXXXXXX XXXXXXXXXX 20L SSOP 9822CAN 20/SS PIC16F84A- Example Legend: MM...M Microchip part number information XX...X Customer specific information* AA Year code (last 2 digits of calendar year) BB Week code (week of January 1 is week ‘01’) C Facility code of the plant at which wafer is manufactured O = Outside Vendor C = 5” Line S = 6” Line H = 8” Line D Mask revision number E Assembly code of the plant or country of origin in which part was assembled Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price. |
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