STM32F756VG datasheet(11/228 Pages) STMICROELECTRONICS

11 / 228 page

DocID027589 Rev 4

11/228

STM32F756xx

List of figures

Figure 87.

WLCSP143, 0.4 mm pitch wafer level chip scale package

top view example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205

Figure 88.

LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package outline . . . . . . . . . . . . . . . 206

Figure 89.

LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207

Figure 90.

LQFP144, 20 x 20mm, 144-pin low-profile quad flat package

top view example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 208

Figure 91.

LQFP176, 24 x 24 mm, 176-pin low-profile quad flat package outline . . . . . . . . . . . . . . . 209

Figure 92.

LQFP176, 24 x 24 mm, 176-pin low-profile quad flat package

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211

Figure 93.

LQFP176, 24 x 24 mm, 176-pin low-profile quad flat package

top view example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212

Figure 94.

LQFP208, 28 x 28 mm, 208-pin low-profile quad flat package outline . . . . . . . . . . . . . . . 213

Figure 95.

LQFP208, 28 x 28 mm, 208-pin low-profile quad flat package

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215

Figure 96.

LQFP208, 28 x 28 mm, 208-pin low-profile quad flat package

top view example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216

Figure 97.

UFBGA 176+25, 10 × 10 × 0.65 mm ultra thin fine-pitch ball grid array

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217

Figure 98.

UFBGA176+25, 10 x 10 x 0.65 mm, ultra fine-pitch ball grid array

package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218

Figure 99.

UFBGA 176+25, 10 × 10 × 0.6 mm ultra thin fine-pitch ball grid array

package top view example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 219

Figure 100. TFBGA216, 13 × 13 × 0.8 mm thin fine-pitch ball grid array

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220

Figure 101. TFBGA216, 13 x 13 x 0.8 mm thin fine-pitch ball grid array

package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221

Figure 102. TFBGA216, 13 × 13 × 0.8 mm thin fine-pitch ball grid array

package top view example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222

STM32F756VG 数据表(PDF) 11 Page - STMicroelectronics

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