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FT121Q-R 数据表(PDF) 40 Page - Future Technology Devices International Ltd. |
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FT121Q-R 数据表(HTML) 40 Page - Future Technology Devices International Ltd. |
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40 / 46 page ![]() Copyright © 2014 Future Technology Devices International Limited 40 Document No.: FT_000648 FT121 ENHANCED USB DEVICE CONTROLLER WITH SPI SLAVE IC Datasheet Version 1.2 Clearance No.: FTDI# 312 9.3 QFN-16 Package Dimensions Figure 9-3 QFN-16 Package Dimensions The FT121Q is supplied in a RoHS compliant leadless QFN-16 package. The package is lead ( Pb ) free, and uses a ‘green’ compound. The package is fully compliant with European Union directive 2002/95/EC. This package is nominally 3mm x 3mm. The solder pads are on a 0.50mm pitch. The above mechanical drawing shows the QFN-16 package. All dimensions are in millimetres. The center pads at the base of the FT121Q are internally connected to a power signal according to the following table. These may be left unconnected or routed to the respective power signal: Pad Number Signal Location – top view Location – bottom view 17 Ground Upper left Upper right 18 VCCIO Lower left Lower right 19 VOUT3V3 Lower right Lower left 20 VCC Upper right Upper left Table 9.1 FT121Q Bottom Pad Assignments |
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