Copyright © 2014 Future Technology Devices International Limited

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Document No.: FT_000648

FT121 ENHANCED USB DEVICE CONTROLLER WITH SPI SLAVE IC

Datasheet Version 1.2

Clearance No.: FTDI#

312

6.4

General Commands........................................................................... 30

6.4.1

Read Current Frame Number....................................................................................... 31

6.4.2

Send Resume ............................................................................................................ 31

6.4.3

Set 3-wire Mode ........................................................................................................ 31

6.4.4

Read Vendor ID ......................................................................................................... 32

6.4.5

Read Product ID ........................................................................................................ 32

6.4.6

Read FTDI ID ............................................................................................................ 32

6.4.7

Set IO Pad Drive Strength........................................................................................... 32

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Application Information ............................................................. 33

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Devices Characteristics and Ratings ........................................... 34

8.1

Absolute Maximum Ratings............................................................... 34

8.2

DC Characteristics............................................................................. 35

8.3

AC Characteristics............................................................................. 36

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Package Parameters................................................................... 38

9.1

TSSOP-16 Package Dimensions ........................................................ 38

9.2

TSSOP-16 Package Markings ........................................................... 39

9.3

QFN-16 Package Dimensions ............................................................ 40

9.4

QFN-16 Package Markings ............................................................... 41

9.5

Solder Reflow Profile ........................................................................ 41

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Contact Information ................................................................... 43

Appendix A – References ........................................................................... 44

Appendix B - List of Figures and Tables ..................................................... 44

Appendix C - Revision History.................................................................... 46