STM32F303VC datasheet(59/148 Pages) STMICROELECTRONICS

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STM32F303xB STM32F303xC

Electrical characteristics

124

6.3

Operating conditions

6.3.1

General operating conditions

Table 24. General operating conditions

Symbol

Parameter

Conditions

Min

Max

Unit

fHCLK

Internal AHB clock frequency

MHz

fPCLK1

Internal APB1 clock frequency

fPCLK2

Internal APB2 clock frequency

VDD

Standard operating voltage

3.6

VDDA

Analog operating voltage

(OPAMP and DAC not used)

Must have a potential

equal to or higher than

VDD

23.6

Analog operating voltage

(OPAMP and DAC used)

2.4

3.6

VBAT

Backup operating voltage

1.65

3.6

VIN

I/O input voltage

TC I/O

–0.3

VDD+0.3

TTa I/O

–0.3

VDDA+0.3

FT and FTf I/O(1)

1. To sustain a voltage higher than VDD+0.3 V, the internal pull-up/pull-down resistors must be disabled.

–0.3

5.5

BOOT0

5.5

Power dissipation at TA =

85 °C for suffix 6 or TA =

105 °C for suffix 7(2)

2. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax (see Section 7.5: Thermal

characteristics).

WLCSP100

500

LQFP100

488

LQFP64

444

LQFP48

364

Ambient temperature for 6

suffix version

Maximum power

dissipation

–40

°C

Low-power dissipation(3)

3. In low-power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see

Section 7.5: Thermal characteristics).

–40

105

Ambient temperature for 7

suffix version

Maximum power

dissipation

–40

105

°C

Low-power dissipation(3)

–40

125

Junction temperature range

6 suffix version

–40

105

°C

7 suffix version

–40

125

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