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STM32F303VC 数据表(PDF) 130 Page - STMicroelectronics |
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STM32F303VC 数据表(HTML) 130 Page - STMicroelectronics |
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130 / 148 page  Package information STM32F303xB STM32F303xC 130/148 DocID023353 Rev 13 Device marking The following figure gives an example of topside marking orientation versus pin 1 identifier location. Figure 44. LQFP64 – 10 x 10 mm, low-profile quad flat package top view example 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering samples in production. ST Quality has to be contacted prior to any decision to use these Engineering samples to run qualification activity. |
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