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STM32F303VC 数据表(PDF) 135 Page - STMicroelectronics |
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STM32F303VC 数据表(HTML) 135 Page - STMicroelectronics |
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135 / 148 page ![]() DocID023353 Rev 13 135/148 STM32F303xB STM32F303xC Package information 141 Table 84. WLCSP100 – 100L, 4.166 x 4.628 mm 0.4 mm pitch wafer level chip scale package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Min Typ Max Typ Min Max A 0.525 0.555 0.585 0.0207 0.0219 0.0230 A1 - 0.17 - - 0.0067 - A2 - 0.38 - - 0.0150 - A3(2) 2. Back side coating. - 0.025 - - 0.0010 - Ø b(3) 3. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 0.22 0.25 0.28 - 0.0098 0.0110 D 4.166 4.201 4.236 - 0.1654 0.1668 E 4.628 4.663 4.698 - 0.1836 0.1850 e - 0.4 - - 0.0157 - e1 - 3.6 - - 0.1417 - e2 - 3.6 - - 0.1417 - F - 0.3005 - - 0.0118 - G - 0.5315 - - 0.0209 - N - 100 - - 3.9370 - aaa - 0.1 - - 0.0039 - bbb - 0.1 - - 0.0039 - ccc - 0.1 - - 0.0039 - ddd - 0.05 - - 0.0020 - eee - 0.05 - - 0.0020 - |
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