STM32F303VC datasheet(143/148 Pages) STMICROELECTRONICS

143 / 148 page

DocID023353 Rev 13

143/148

STM32F303xB STM32F303xC

Revision history

147

05-Dec-2012

Updated first page

Removed references to VDDSDx and VSSSD

Added reference to PM0214 in Section 1

Moved Temp. sensor calibartion values toTable 79 and VREF calibration

values to Table 29

Updated Table 3: STM32F303xx family device features and peripheral

counts

UpdatedSection 3.4: Embedded SRAM

Updated Section 3.2: Memory protection unit (MPU)

Updated Section 3.24: Universal serial bus (USB)

Modified Section 3.26: Touch sensing controller (TSC)

Updated heading of Table 11: USART features

Updated Table 16: STM32F302xB/STM32F302xC pin definitions

Added notes to PC13, PC14 and PC15 in Table 16:

STM32F302xB/STM32F302xC pin definitions

Updated Figure 11: Power supply scheme

Modified Table 21: Voltage characteristics

Modified Table 22: Current characteristics

Modified Table 24: General operating conditions

Modified Figure 13: Typical VBAT current consumption (LSE and RTC

ON/LSEDRV[1:0] = ’00’)

Updated Section 6.3.14: I/O port characteristics

Updated Table 30: Typical and maximum current consumption from VDD

supply at VDD = 3.6V and Table 31: Typical and maximum current

consumption from the VDDA supply

Updated Table 32: Typical and maximum VDD consumption in Stop and

Standby modes and Table 33: Typical and maximum VDDA consumption

in Stop and Standby modes

Updated Table 34: Typical and maximum current consumption from

VBAT supply

Added Figure 13: Typical VBAT current consumption (LSE and RTC

ON/LSEDRV[1:0] = ’00’)

Updated Table 35: Typical current consumption in Run mode, code with

data processing running from Flash and Table 36: Typical current

consumption in Sleep mode, code running from Flash or RAM

Added Table 38: Peripheral current consumption

Added Table 37: Switching output I/O current consumption

Updated Section 6.3.6: Wakeup time from low-power mode

Modified ESD absolute maximum ratings

Modified Table 55: Output voltage characteristics

Updated EMI characteristics

Updated Table 56: I/O AC characteristics

Updated Table 53: I/O current injection susceptibility

Updated Table 58: TIMx characteristics

Updated Section 7.4: WLCSP100 - 0.4 mm pitch wafer level chip scale

package information

Added Table 69: Maximum ADC RAIN

Added Table 70: ADC accuracy - limited test conditions, 100-pin

packages

Updated Table 64: ADC accuracy - limited test conditions 2)

Updated Table 75: DAC characteristics

Updated Table 77: Operational amplifier characteristics

Updated figures and tables in Section 7: Package information

Table 88. Document revision history (continued)

Date

Revision

Changes

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