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TNETV2685FIBZUT9 数据表(PDF) 104 Page - Texas Instruments |
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TNETV2685FIBZUT9 数据表(HTML) 104 Page - Texas Instruments |
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104 / 191 page  TMS320DM647 TMS320DM648 SPRS372H – MAY 2007 – REVISED APRIL 2012 www.ti.com 6.9.3.3 PCB Stackup The minimum stackup required for routing the device is a six-layer stack as shown in Table 6-30. Additional layers may be added to the PCB stack up to accommodate other circuity or to reduce the size of the PCB footprint. Table 6-30. Minimum PCB Stack Up LAYER TYPE DESCRIPTION 1 Signal Top routing mostly horizontal 2 Plane Ground 3 Plane Power 4 Signal Internal routing 5 Plane Ground 6 Signal Bottom routing mostly vertical Complete stack up specifications are provided in Table 6-31. Table 6-31. PCB Stack Up Specifications NO. PARAMETER MIN TYP MAX UNIT 1 PCB Routing/Plane Layers 6 2 Signal Routing Layers 3 3 Full ground layers under DDR2 routing Region 2 4 Number of ground plane cuts allowed within DDR routing region 0 5 Number of ground reference planes required for each DDR2 routing layer 1 6 Number of layers between DDR2 routing layer and reference ground plane 0 7 PCB Routing Feature Size 4 Mils 8 PCB Trace Width w 4 Mils 8 PCB BGA escape via pad size 18 Mils 9 PCB BGA escape via hole size 8 Mils 10 DSP Device BGA pad size(1) 11 DDR2 Device BGA pad size(2) 12 Single Ended Impedance, Zo 50 75 Ω 13 Impedance Control(3) Z-5 Z Z+5 Ω (1) See the Flip Chip Ball Grid Array Package Reference Guide (SPRU811) for DSP device BGA pad size. (2) See the DDR2 device manufacturer documenation for the DDR2 device BGA pad size. (3) Z is the nominal singled ended impedance selected for the PCB specified by item 12. 6.9.3.4 Placement Figure 6-13 shows the required placement for the device as well as the DDR2 devices. The dimensions for Figure 6-13 are defined in Table 6-32. The placement does not restrict the side of the PCB where the devices are mounted. The purpose of the placement is to limit the maximum trace lengths and allow for proper routing space. For 16-bit DDR memory systems, the high word DDR2 device is omitted from the placement. 104 Peripheral Information and Electrical Specifications Copyright © 2007–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320DM647 TMS320DM648 |
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