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TNETV2685FIBZUT9 数据表(PDF) 105 Page - Texas Instruments

部件名 TNETV2685FIBZUT9
功能描述  Digital Media Processor
PDF  191 Pages
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制造商  TI1 [Texas Instruments]
网页  http://www.ti.com
标志 TI1 - Texas Instruments

TNETV2685FIBZUT9 数据表(HTML) 105 Page - Texas Instruments

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A1
A1
X
Y
OFFSET
RecommendedDDR2Device
Orientation
Y
Y
OFFSET
DDR2
Device
DM648
A1
A1
DDR2Device
TMS320DM647
TMS320DM648
www.ti.com
SPRS372H – MAY 2007 – REVISED APRIL 2012
A.
DM648 is shown in this figure as an example of the device and represents the entire set of devices that include:
DM647/DM648.
Figure 6-13. DDR2 Device Placement
Table 6-32. Placement Specifications
NO.
PARAMETER
MIN
MAX
UNIT
1
X(1) (2)
1660
Mils
2
Y(1) (2)
1280
Mils
3
Y Offset(1) (2) (3)
650
Mils
4
DDR2 Keepout Region(4)
5
Clearance from non-DDR2 signal to DDR2 Keepout Region(5)
4
w
(1)
See Figure 6-11 for dimension defintions.
(2)
Measurements from center of DSP device to center of DDR2 device.
(3)
For 16-bit memory systems, it is recommended that Y Offset be as small as possible.
(4)
DDR2 Keepout region to encompass entire DDR2 routing area
(5)
Non-DDR2 signals allowed within DDR2 keepout region provided they are separated from DDR2 routing layers by a ground plane.
6.9.3.5
DDR2 Keep Out Region
The region of the PCB used for the DDR2 circuitry must be isolated from other signals. The DDR2 keep
out region is defined for this purpose and is shown in Figure 6-14. The size of this region varies with the
placement and DDR routing. Additional clearances required for the keep out region are shown in Table 6-
32.
Figure 6-14. DDR2 Keepout Region
Copyright © 2007–2012, Texas Instruments Incorporated
Peripheral Information and Electrical Specifications
105
Submit Documentation Feedback
Product Folder Link(s): TMS320DM647 TMS320DM648



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