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5812-DS01-R 数据表(PDF) 62 Page - Broadcom Corporation. |
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5812-DS01-R 数据表(HTML) 62 Page - Broadcom Corporation. |
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62 / 84 page ![]() BCM5812 Advance Data Sheet 3/11/03 B roa dcom Co rpo rat ion Page 54 Signal Definitions Document 5812-DS01-405-R TCK I Test mode clock for JTAG boundary scan. Unused in normal operation; connect to either high or low static level. It is internally pulled up. TDI I Test data in for JTAG boundary scan. Unused in normal operation; connect to either high or low static level. It is internally pulled up. TDO O Test data out for JTAG boundary scan. Unused in normal operation. RNGOSC I Optional random number generator oscillator. It is Ex-ORed with internal oscillator to provide random number source. It is internally pulled down. EEPROM I If EEPROM is Low, the PCI configuration space is loaded from attached EEPROM. Otherwise, the PCI configuration space contains default values. It is internally pulled up. EEPROM_CS O Chip Select for the attached EEPROM. It connects to Chip Select pin of the EEPROM. EEPROM_SK O Serial Clock for the attached EEPROM. It connects to Serial Clock pin of the EEPROM. EEPROM_DI I Data In for the attached EEPROM. It connects to Data Out pin of the EEPROM. EEPROM_DO O Data Out for the attached EEPROM. It connects to Data In pin of the EEPROM. NC1... NC10 – Test pins, must be left unconnected (floating). Table 17: Signal Definitions (Cont.) Signal Name I/O Description |
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