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5812-DS01-R 数据表(PDF) 70 Page - Broadcom Corporation. |
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5812-DS01-R 数据表(HTML) 70 Page - Broadcom Corporation. |
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70 / 84 page ![]() BCM5812 Advance Data Sheet 3/11/03 B roa dcom Co rpo rat ion Page 62 Electrical and Timing Characteristics Document 5812-DS01-405-R Se c t ion 4: El ec tr ic al an d Ti m i ng C h a r ac te ri sti c s BCM5812 PCI pins violate THD slightly (0.6 ns vs. 0 ns in the PIC Spec). TVAL, TSU, and TSU(PTP) are within the PCI timing specifications in the entire operating range. Table 22: Electrical and Timing Specifications Parameter Typical Description PCI Compliance 3.3V and 5V Over the range of 25-33 MHz PCI clocks Supply Voltage 3.3V ± 5% 1.8V ± 5% For I/O buffers For the core I/O Buffers 3.3V Operating Temperature 0-70C Within the commercial temperature range DC Characteristics for the I/O Pins Follows the PCI 2.2 DC specifications The BCM5812 works in both 3.3V and 5V environments Table 23: PCI Pin Timing Specifications Symbol Parameter 33 MHz Units Min Max TVAL PCI_CLK to Signal Valid Delay - bussed signals 2 11 ns TSU Input Setup Time to PCI_CLK - bussed signals 7 ns TSU(PTP) Input Setup Time to PCI_CLK - point to point signals (REQ and GNT) 10, 12 ns THD Input Hold Time from PCI_CLK 0 ns Table 24: Power Consumption (BCM5812-200) Parameter Max Power Max Current Max Voltage (Vnominal +5%) Peripheral 0.05W 14.4 mA 3.46V Core 0.4W 211 mA 1.89V |
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