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STV0974 数据表(PDF) 53 Page - STMicroelectronics

部件名 STV0974
功能描述  Mobile Imaging DSP
PDF  69 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STV0974 数据表(HTML) 53 Page - STMicroelectronics

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Electrical characteristics
STV0974
53/61
5
Electrical characteristics
5.1
Absolute maximum ratings
Caution: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent
damage to the device. This is a stress rating only and functional operation of the device at these or
any other conditions above those indicated in the operational sections of this specification is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
5.2
Operating conditions
5.3
Thermal data
Symbol
Parameter
Value
Unit
VDD
(including
VCORE &
VDDPOR)
Supply voltage
-0.5 to +2.2
V
Voltage on any signal pin
-0.5 to (VDD + 0.5)
V
IDD
Supply current
100
mA
Current on any signal pin
±10
mA
TSTO
Storage temperature
-40 to 150
°C
TLEAD, 974E
Lead temperature (soldering, 10 s) for lead-free package
+260
°C
TLEAD, 974
Lead temperature (soldering, 10 s) for leaded package
+225
°C
Symbol
Parameter
Value
Unit
VDD
Supply voltage
+1.7 to +1.9
V
TA
Ambient temperature
-25 to +70
°C
Symbol
Parameter
Value
Unit
Rth(j-a)
Junction-ambient thermal resistance - TFBGA56a
a. Typical, measured with the component mounted on an evaluation PC board in free air.
65
°C/W



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