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SPC58EEX 数据表(PDF) 153 Page - STMicroelectronics |
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SPC58EEX 数据表(HTML) 153 Page - STMicroelectronics |
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153 / 154 page ![]() DS11646 Rev 4 153/154 SPC58EEx, SPC58NEx Revision history 153 01-Jul-2019 4(cont’) Section 3.16.2: Voltage regulators Section 3.16.1: Power management integration – Table 39: External components integration: updated Conditions for CBV. Section 3.16.3: Voltage monitors Table 45: Voltage monitor electrical characteristics: added footnote “Even if LVD/HVD ...” Table 46: Wait State configuration: for APC=001 changed the minimum frequency from 40 to 55 MHz. Section 3.17: Flash memory Updated Table 47: Flash memory program and erase specifications Table 48: Flash memory Life Specification: updated table with NCER128K and NDER16K. Updated Table 54: DSPI channel frequency support Table 68: TxEN output characteristics: added table footnote “ Pad configured as VERY STRONG.” Table 69: TxD output characteristics: changed note 3 to apply to the whole table Table 72: CAN timing: added columns for “CC” and “D” Section 3.18.3.7: RMII transmit signal timing (TXD[1:0], TX_EN): added Note “RMII transmit ... as 1ns”. Section 3.18.1.2: Nexus interface timing – Table 50: Nexus debug port timing: Updated Min values for tTCYC Absolute minimum TCK cycle time. Updated Max value on line 15. – Figure 16: Nexus output timing: deleted this figure. Table 79: FPBGA292 package mechanical data: updated Amax formula in table footnote 2. Section 4.1: eLQFP176 package information: updated section according latest POA. Section 4.2: FPBGA292 package information – Figure 54: FPBGA292 package outline: minor format changes. – Table 79: FPBGA292 package mechanical data: updated footnote 2. Table 80: Thermal characteristics for 176 exposed pad LQFP package and Table 81: Thermal characteristics for 292-pin FPBGA updated values Table 84. Document revision history (continued) Date Revision Changes |
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