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9.2.6 High Speed Differential Signal Routing Guidance

The High Speed Interface Layout Guidelines provides guidance for successful routing of the high speed

differential signals. This includes PCB stackup and materials guidance as well as routing skew, length and

spacing limits. TI supports only designs that follow the board design guidelines contained in the application

report.

9.2.7 Thermal Solution Guidance

The Thermal Design Guide for DSP and ARM Application Processors provides guidance for successful

implementation of a thermal solution for system designs containing this device. This document provides

background information on common terms and methods related to thermal solutions. TI only supports designs

that follow system design guidelines contained in the application report.

9.3 Clock Routing Guidelines

9.3.1 Oscillator Routing

When designing the printed-circuit board:

• Place the crystal circuit on the same side of the PCB as the device and as close as possible to the respective

device pins.

• Place the crystal circuit traces on the outer layer of the PCB when possible, with the lengths being as short as

possible to reduce parasitic capacitance and minimize crosstalk from other signals.

• Do not route any other signals under the crystal circuit traces if there is an adjacent signal layer on the PCB.

• Route all crystal circuit component ground connections to one common ground via. This via must directly

connect to the ground plane.

• Treat oscillator pins the same way as other device VSS pins: connect them to board ground as near to the

ball as possible.

Note

Proper ground-guard trace in PCB design is critical for effective oscillator operation.

9.3.2 Oscillator Ground Connection

Refer to Section 7.10.4.1.1 for the Oscillator Ground Connection diagram.

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AM2434, AM2432, AM2431

SPRSP65D – APRIL 2021 – REVISED AUGUST 2022

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AM2434...ALV 数据表(PDF) 263 Page - Texas Instruments