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AM2434...ALV 数据表(PDF) 129 Page - Texas Instruments |
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AM2434...ALV 数据表(HTML) 129 Page - Texas Instruments |
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129 / 280 page  7.9 Thermal Resistance Characteristics For operation and reliability concerns, the maximum junction temperature of the device must be equal to or less than the TJ value identified in Recommended Operating Conditions. 7.9.1 Thermal Resistance Characteristics Table 7-2. Thermal Resistance Characteristics TI recommends performing system level thermal simulations with worst case device power consumption. NO. PARAMETER(1) DESCRIPTION °C/W(2) AIR FLOW (m/s)(3) ALV Package T1 RΘJC Junction-to-case 0.98 N/A T2 RΘJB Junction-to-board 3.87 N/A T3 RΘJA Junction-to-free air 12.8 0 T4 RΘJA Junction-to-moving air 9.2 1 T5 8.2 2 T6 7.6 3 T7 ΨJT Junction-to-package top 0.53 0 T8 0.55 1 T9 0.57 2 T10 0.58 3 T11 ΨJB Junction-to-board 3.74 0 T12 3.5 1 T13 3.4 2 T14 3.3 3 ALX Package T1 RΘJC Junction-to-case 4.8 N/A T2 RΘJB Junction-to-board 5.4 N/A T3 RΘJA Junction-to-free air 19.8 0 T4 RΘJA Junction-to-moving air 14.1 1 T5 13 2 T6 12.3 3 T7 ΨJT Junction-to-package top 0.06 0 T8 0.16 1 T9 0.21 2 T10 0.25 3 T11 ΨJB Junction-to-board 5.3 0 T12 4.95 1 T13 4.88 2 T14 4.83 3 (1) These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC defined 1S0P system) and is subject to change based on environment as well as application. For more information, see the EIA/JEDEC standards. • JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air) • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Packages (2) °C/W = degrees Celsius per watt. (3) m/s = meters per second. www.ti.com AM2434, AM2432, AM2431 SPRSP65D – APRIL 2021 – REVISED AUGUST 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 129 Product Folder Links: AM2434 AM2432 AM2431 |
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