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STM32F405 数据表(PDF) 178 Page - STMicroelectronics |
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STM32F405 数据表(HTML) 178 Page - STMicroelectronics |
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178 / 204 page  Package information STM32F405xx, STM32F407xx 178/203 DS8626 Rev 9 Figure 88. UFBGA176+25 - 201-ball, 10 x 10 mm, 0.65 mm pitch, ultra fine pitch ball grid array recommended footprint Note: Non solder mask defined (NSMD) pads are recommended. 4 to 6 mils solder paste screen printing process. Stencil opening is 0.300 mm. Stencil thickness is between 0.100 mm and 0.125 mm. Pad trace width is 0.100 mm. eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 96. UFBGA176+2 recommended PCB design rules (0.65 mm pitch BGA) Dimension Recommended values Pitch 0.65 Dpad 0.300 mm Dsm 0.400 mm typ. (depends on the soldermask registration tolerance) Table 95. UFBGA176+25 ball, 10 × 10 × 0.65 mm pitch, ultra thin fine pitch ball grid array mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max A0E7_FP_V1 Dpad Dsm |
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