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STM32L082KB 数据表(PDF) 129 Page - STMicroelectronics |
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STM32L082KB 数据表(HTML) 129 Page - STMicroelectronics |
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129 / 132 page ![]() DS10688 Rev 7 129/132 STM32L082xx Revision history 131 14-Sep-2017 5 Memories and I/Os moved after Core in Features. Table 1: Ultra-low-power STM32L082xx device features and peripheral counts: changed number of USART for LQFP32/UFQFPN32 and added note 3. Removed column "I/O operation" from Table 2: Functionalities depending on the operating power supply range and added note related to GPIO speed. Updated VDD_USB in Section 3.4.1: Power supply schemes. In Section 4: Pin descriptions, renamed USB_OE into USB_NOE. In Section 5: Memory mapping, replaced memory mapping schematic by reference to the reference manual. Updated Figure 3: STM32L082xx WLCSP49 ballout Added mission profile compliance with JEDEC JESD47 in Section 6.2: Absolute maximum ratings. Updated minimum and maximum values of I/O weak pull-up equivalent resistor (RPU) and weak pull-down equivalent resistor (RPD) in Table 57: I/O static characteristics. Updated minimum and maximum values of NRST weak pull-up equivalent resistor (RPU) in Table 60: NRST pin characteristics. Added note 2. related to the position of the external capacitor below Figure 24: Recommended NRST pin protection. Updated RAIN in Table 61: ADC characteristics. Updated Figure 29: 12-bit buffered/non-buffered DAC and added note below figure. Updated tAF maximum value for range 1 in Table 70: I2C analog filter characteristics. Removed Table 90: USART/LPUART characteristics. NSS timing waveforms updated in Figure 30: SPI timing diagram - slave mode and CPHA = 0 and Figure 31: SPI timing diagram - slave mode and CPHA = 1(1). Added reference to optional marking or inset/upset marks in all package device marking sections. Updated note below marking schematics. Table 83. Document revision history (continued) Date Revision Changes |
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