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TDA4VL...ALZQ1 数据表(PDF) 154 Page - Texas Instruments |
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TDA4VL...ALZQ1 数据表(HTML) 154 Page - Texas Instruments |
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154 / 251 page ![]() RMII4 RMII5 RMII[x]_ _ REF CLK RMII[x]_RXD[1:0], RMII[x]_CRS_DV, RMII[x]_RX_ER Figure 7-37. CPSW2G RMII[x]_RXD[1:0], RMII[x]_CRS_DV, RMII[x]_RX_ER Timing Requirements – RMII Mode Section 7.10.5.2.2.3, and Figure 7-38 present switching characteristics for CPSW2G RMII Transmit. 7.10.5.2.2.3 CPSW2G RMII[x]_TXD[1:0], and RMII[x]_TX_EN Switching Characteristics – RMII Mode see Figure 7-38 NO. PARAMETER MIN MAX UNIT RMII6 td(ref_clkH-txdV) Delay time, RMII[x]_REF_CLK rising edge to RMII[x]_TXD[1:0] valid 2 10 ns td(ref_clkH-tx_enV) Delay time, RMII[x]_REF_CLK rising edge to RMII[x]_TX_EN valid 2 10 ns RMII[x]_TXD[1:0], RMII[x]_TX_EN RMII6 RMII[x]_REF_CLK Figure 7-38. RMII[x]_TXD[1:0], and RMII[x]_TX_EN Switching Characteristics – RMII Mode 7.10.5.2.3 CPSW2G RGMII Timings Section 7.10.5.2.3.1, Section 7.10.5.2.3.2, and Figure 7-40 present timing requirements for receive RGMII operation. For more information, see Gigabit Ethernet MAC (MCU_CPSW0) section in Peripherals chapter in the device TRM. Table 7-30. CPSW2G RGMII Timing Conditions PARAMETER MIN MAX UNIT INPUT CONDITIONS SRI Input slew rate VDD(1) = 1.8 V 1.44 5 V/ns VDD(1) = 3.3 V 2.64 5 V/ns OUTPUT CONDITIONS CL Output load capacitance 2 20 pF PCB CONNECTIVITY REQUIREMENTS td(Trace Mismatch Delay) Propagation delay mismatch across all traces RGMII[x]_RXC, RGMII[x]_RD[3:0], RGMII[x]_RX_CTL 50 ps RGMII[x]_TXC, RGMII[x]_TD[3:0], RGMII[x]_TX_CTL 50 ps (1) VDD stands for corresponding power supply. For more information on the power supply name and the corresponding ball(s), see POWER column of the Pin Attributes. TDA4VE-Q1, TDA4AL-Q1, TDA4VL-Q1 SPRSP62 – DECEMBER 2022 www.ti.com 154 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: TDA4VE-Q1 TDA4AL-Q1 TDA4VL-Q1 |
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