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TDA4VL...ALZQ1 数据表(PDF) 157 Page - Texas Instruments

部件名 TDA4VL...ALZQ1
功能描述  TDA4VE TDA4AL TDA4VL Jacinto™ Processors, Silicon Revision 1.0
PDF  251 Pages
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制造商  TI [Texas Instruments]
网页  http://www.ti.com
标志 TI - Texas Instruments

TDA4VL...ALZQ1 数据表(HTML) 157 Page - Texas Instruments

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7.10.5.3 CSI-2
Note
For more information, see the Camera Streaming Interface Receiver (CSI_RX_IF) chapter in the
device TRM.
The CSI_RX_IF deals with the processing of the pixel data coming from an external image sensor and data from
memory. It is a key component for the following multimedia applications: camera viewfinder, video record, and
still image capture.
The CSI_RX_IF has a primary serial interface (CSI-2 port) compliant with the MIPI D-PHY RX specification v1.2
and the MIPI CSI-2 specification v1.3, with 4 differential data lanes plus 1 differential clock lane in synchronous
mode, double data rate. Refer to the specification for timing details.
• 2.5 Gbps (1.25 GHz) for each lane.
7.10.5.4 DDRSS
For more details about features and additional description information on the device LPDDR4 Memory
Interfaces, see the corresponding sections within Signal Descriptions and Detailed Description.
The device has dedicated interface to LPDDR4. It supports JEDEC JESD209-4B standard compliant LPDDR4
SDRAM devices with the following features:
• 32-bit data path to external SDRAM memory
• Memory device capacity: Up to 8GB address space available over two chip selects (4GB per rank)
• No support for byte mode LPDDR4 memories, or memories with more than 17 row address bits
Table 7-31 and Figure 7-41 present switching characteristics for DDRSS.
Table 7-31. Switching Characteristics for DDRSS
NO.
PARAMETER
DDR TYPE
MIN
MAX
UNIT
1
tc(DDR_CKP/DDR_CKN)
Cycle time, DDR0_CKP and DDR0_CKN
LPDDR4
0.4681
3.003
ns
1. Maximum DDR Frequency will be limited based on the specific memory type (vendor) used in a system
and by PCB implementation. TI strongly recommends all designs to follow the TI LPDDR4 EVM PCB
layout exactly in every detail (routing, spacing, vias/backdrill, PCB material, etc.) in order to achieve the full
specified clock frequency. Refer to the Jacinto 7 DDR Board Design and Layout Guidelines for details.
DDR0_CKP
1
DDR0_CKN
Figure 7-41. DDRSS Memory Interface Clock Timing
For more information, see DDR Subsystem (DDRSS) section in Memory Controllers chapter in the device TRM.
7.10.5.5 DSS
For more details about features and additional description information on the device Display Subsystem – Video
Output Ports, see the corresponding sections within Signal Descriptions and Detailed Description.
Table 7-32 represents DPI timing conditions.
Table 7-32. DPI Timing Conditions
PARAMETER
MIN
MAX
UNIT
INPUT CONDITIONS
SRI
Input slew rate
1.44
26.4
V/ns
www.ti.com
TDA4VE-Q1, TDA4AL-Q1, TDA4VL-Q1
SPRSP62 – DECEMBER 2022
Copyright © 2023 Texas Instruments Incorporated
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Product Folder Links: TDA4VE-Q1 TDA4AL-Q1 TDA4VL-Q1



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