| 数据搜索系统,热门电子元器件搜索 |
|
P9415-R 数据表(PDF) 39 Page - Renesas Technology Corp |
|
|
|||||||||||||||||||||||||||||
P9415-R 数据表(HTML) 39 Page - Renesas Technology Corp |
|
39 / 62 page ![]() P9415-R Datasheet © 2021 Renesas Electronics Corporation 39 May 4, 2021 9.14PCB Layout Considerations For optimum device performance and lowest output noise, the following guidelines should be observed. Please contact Renesas for Gerber files that contain the recommended board layout. An optimum layout is one with all components on the same side of the board, minimizing vias through other signal layers. Signal traces not related to the P9415-R should be routed away from the IC as much as possible to avoid blocking thermal dissipation paths from the IC to the PCB. This includes signal traces just underneath the device, or on layers adjacent to the ground plane layer used by the device. Layout and PCB design have a significant influence on the power dissipation capabilities of power management ICs because the surface-mount packages used with these devices rely heavily on thermally conductive traces or pads to transfer heat away from the package. Appropriate PC layout techniques should be used to remove the heat due to device power dissipation. The following general guidelines are helpful with designing a board layout for lowest thermal resistance: 1. PC board traces with large cross-sectional areas remove more heat. For optimum results, use large-area PCB patterns with wide copper traces, placed on the P9415-R side of the PCB. 2. In cases where maximum heat dissipation is required, use double-sided copper planes connected with multiple vias. 3. Thermal vias are needed to provide a thermal path to inner and/or bottom layers of the PCB to remove the heat generated by device power dissipation. 9.15Special Notes Package assembly: Unopened dry packaged parts have a one-year shelf life. The HIC indicator card for newly-opened dry packaged parts should be checked. If there is any moisture content, the parts must be baked for a minimum of 8 hours at 125˚C within 24 hours of the assembly reflow process. 10. I2C Function The P9415-R uses standard I2C slave implementation protocol to communicate with a host Application Processor (AP) or other I2C peripherals. The I2C slave address is decided by GP4 voltage. During the P9451-R power-up, if the GP4 pin is pulled down, the I2C address is 0x3B. During the P9451-R power-up, if the GP4 pin is pulled high, the I2C address is 0x3F. The AP can write to only the registers that are marked as Read/Write (RW). Registers marked as Read Only (R) should never be sent a Write command. Likewise, register locations marked Reserved should not receive a Write command. When writing to a RW register that contains a combination of RW fields and reserved fields, a read-modify-write should be performed to the intended bit/field only. All other bits, including reserved bits should NOT be modified. |
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |