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STM32U535NET3QTR 数据表(PDF) 274 Page - STMicroelectronics |
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STM32U535NET3QTR 数据表(HTML) 274 Page - STMicroelectronics |
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274 / 278 page ![]() Package information STM32U535xx 274/278 DS14217 Rev 1 Figure 75. UFBGA100 - Recommended footprint ddd - - 0.080 - - 0.0031 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 143. UFBGA100 - Recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the solder mask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Table 142. UFBGA100 - Mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. BGA_WLCSP_FT_V1 Dsm Dpad |
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