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M95M02-DF 数据表(PDF) 34 Page - STMicroelectronics |
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M95M02-DF 数据表(HTML) 34 Page - STMicroelectronics |
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34 / 45 page ![]() 10.2 WLCSP8 without BSC package information This WLCSP is a 8-ball, 3.556 x 2.011 mm, without BSC, wafer level chip scale package. Figure 26. WLCSP8 without BSC - Outline D E Orientation reference X Y TOP VIEW (4X) aaa aaa Z A A2 SEATING PLANE DETAIL A BOTTOM VIEW J G e2 H e1 e F G H Orientation reference eee Z BUMP A1 ddd Z ccc Z Y b(8x) Z DETAIL A ROTATED 900 1. Drawing is not to scale. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. M95M02-DR M95M02-DF WLCSP8 without BSC package information DS7024 - Rev 13 page 34/45 |
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