| 数据搜索系统,热门电子元器件搜索 |
|
M95M02-DF 数据表(PDF) 36 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
M95M02-DF 数据表(HTML) 36 Page - STMicroelectronics |
|
36 / 45 page ![]() 10.3 WLCSP8 with BSC package information This WLCSP is a 8-ball, 3.556 x 2.011 mm, with BSC, wafer level chip scale package. Figure 28. WLCSP8 with BSC - Outline SIDE VIEW Bump Seating plane Detail A (Rotated 90°) Ø b(x8) A1 TOP VIEW Orientation reference Detail A A A2 E D (4x) BOTTOM VIEW F e2 G e e1 X Y Z Z Z X Y ccc ddd Z eee aaa bbb Z H F H J Orientation reference A3 1. Drawing is not to scale. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. M95M02-DR M95M02-DF WLCSP8 with BSC package information DS7024 - Rev 13 page 36/45 |
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |