M95M02-DF datasheet(39/45 Pages) STMICROELECTRONICS

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Revision history

Table 20. Document revision history

Date

Revision

Changes

15-Nov-2010

Initial release.

10-Dec-2010

Updated DC and AC characteristics according to characterization test results.

10-Jan-2011

Updated ordering information.

10-May-2011

Updated Table 13: AC characteristics and related text, and Table 12: DC characteristics.

19-Oct-2011

Changed datasheet status to full datasheet.

Modified Section 1: Description.

Added Figure 3: WLSCP connections (bump side view).

Updated Figure 4: Bus master and memory devices on the SPI bus and

Figure 7: Block diagram.

Modified Section 7: ECC (error correction code) and write cycling.

Updated Note 2 in Table 7: Absolute maximum ratings.

Added Table 8: Memory cell characteristics.

Updated Figure 24: M95M02-DR WLCSP package outline and Table 15:

M95M02-DR WLCSP package mechanical data.

Updated disclaimer on last page.

04-Oct-2012

Text and structure of document modified as per new M95xxx standard EEPROM datasheet

template.

Updated:

•

Cycling: 4 million cycles

•

Data retention: 200 years

Added:

•

Standard WLCSP (CS)

19-Dec-2012

Updated Section 7.2: Initial delivery state.

Restored Figure 23, Figure 24 and Figure 25.

13-Mar-2013

Document reformatted.

Replaced “ball” by “bump” in the entire document.

Deleted Figure 3: Thin WLCSP connections (bump side view), Figure 24: M95M02-DR thin WLCSP

package (CT) outline, bump side view and

Table 15: M95M02-DR thin WLCSP package mechanical data.

Renamed Figure 39: M95M02-DRCS6TP/K, WLCSP standard package outline, bump side view and

Table 55: M95M02-DRCS6TP/K, WLCSP package mechanical data.

Updated package information in Table 20: Ordering information scheme.

15-Sep-2014

Updated WLCSP (CS) package figure on cover page.

Removed “Preliminary data” footnote from Figure 3, Figure 24 and Table 16.

Removed note about exposure to UV light in Section 10: Package information.

Updated Table 4: Instruction set, and removed footnotes from it.

Added Table 5: Significant bits within the address bytes and Figure 27:

WLCSP 8-bump wafer length chip-scale recommended land pattern.

Updated Note 1 in Table 12: Absolute maximum ratings.

Updated Table 16: AC characteristics and Table 20: Ordering information scheme.

22-Jun-2015

Updated Features and WLCSP figure on cover page.

Updated Figure 3: WLCSP connections, Figure 4: Block diagram and Figure 14: Page Write

(WRITE) sequence.

M95M02-DR M95M02-DF

DS7024 - Rev 13

page 39/45

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