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UJA1069 数据表(PDF) 41 Page - NXP Semiconductors |
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UJA1069 数据表(HTML) 41 Page - NXP Semiconductors |
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41 / 64 page ![]() UJA1069_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 5 March 2007 41 of 64 NXP Semiconductors UJA1069 LIN fail-safe system basis chip 8. Thermal characteristics Fig 15. Thermal model of the HTSSOP32 package Fig 16. Thermal model of the HTSSOP24 package Rth(c-a) Tcase(heat sink) Tamb 001aad671 V1 dissipation V3 dissipation other dissipation 6 K/W 23 K/W 6 K/W 6 K/W Tvj Rth(c-a) Tcase(heat sink) Tamb 001aae136 V1 dissipation V3 dissipation other dissipation 6 K/W 17 K/W 6 K/W 6 K/W Tvj |
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