UJA1069 datasheet(3/64 Pages) PHILIPS

3 / 64 page

UJA1069_2

Preliminary data sheet

Rev. 02 — 5 March 2007

3 of 64

NXP Semiconductors

UJA1069

LIN fail-safe system basis chip

2.4 Fail-safe features

I Safe and predictable behavior under all conditions

I Programmable fail-safe coded window and time-out watchdog with on-chip oscillator,

guaranteeing autonomous fail-safe system supervision

I Fail-safe coded 16-bit SPI interface for the microcontroller

I Global enable pin for the control of safety-critical hardware

I Detection and detailed reporting of failures:

N On-chip oscillator failure and watchdog alerts

N Battery and voltage regulator undervoltages

N LIN-bus failures (short-circuits)

N TXD and RXD clamping situations and short-circuits

N Clamped or open reset line

N SPI message errors

N Overtemperature warning

I Rigorous error handling based on diagnostics

I Supply failure early warning allows critical data to be stored

I 23 bits of access-protected RAM is available e.g. for logging of cyclic problems

I Reporting in a single SPI message; no assembly of multiple SPI frames needed

I Limp-home output signal for activating application hardware in case system enters

Fail-safe mode (e.g. for switching on warning lights)

I Fail-safe coded activation of Software development mode and Flash mode

I Unique SPI readable device type identiﬁcation

I Software-initiated system reset

Ordering information

[1]

UJA1069TW/5V0 is for the 5 V version; UJA1069TW/3V3 is for the 3.3 V version; UJA1069TW/3V0 is for the 3 V version.

[2]

UJA1069TW24/5V0 is for the 5 V version; UJA1069TW24/3V3 is for the 3.3 V version; UJA1069TW/3V0 is for the 3 V version.

Table 1.

Ordering information

Type number

Package

Name

Description

Version

UJA1069TW[1]

HTSSOP32

plastic thermal enhanced thin shrink small outline package; 32 leads;

body width 6.1 mm; lead pitch 0.65 mm; exposed die pad

SOT549-1

UJA1069TW24[2]

HTSSOP24

plastic thermal enhanced thin shrink small outline package; 24 leads;

body width 4.4 mm; lead pitch 0.65 mm; exposed die pad

SOT864-1

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