UJA1069 datasheet(59/64 Pages) PHILIPS

59 / 64 page

UJA1069_2

Preliminary data sheet

Rev. 02 — 5 March 2007

59 of 64

NXP Semiconductors

UJA1069

LIN fail-safe system basis chip

Fig 28. Package outline SOT864-1 (HTSSOP24)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

SOT864-1

MO-153

SOT864-1

04-09-23

05-12-06

DIMENSIONS (mm are the original dimensions)

HTSSOP24: plastic thermal enhanced thin shrink small outline package; 24 leads;

body width 4.4 mm; lead pitch 0.65 mm; exposed die pad

detail X

(A3)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

w M

pin 1 index

exposed die pad

2.5

5 mm

scale

UNIT

max

1.1

0.15

0.05

0.95

0.80

0.30

0.19

0.2

0.1

7.9

7.7

4.5

4.3

6.6

6.2

0.75

0.50

0.5

0.2

0.25

D(1)

E(2)

0.65

3.3

3.1

4.3

4.1

0.2

0.13

0.1

8°

0°

112

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