MPC5633MMLL80 datasheet(68/106 Pages) FREESCALE

68 / 106 page

MPC5634M Microcontroller Data Sheet, Rev. 8

Freescale Semiconductor

Table 10. Thermal characteristics for 176-pin LQFP1

1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.

Symbol

Parameter

Conditions

Value

Unit

RJA

D Junction-to-Ambient, Natural Convection2

2 Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board

meets JEDEC specification for this package.

Single layer board - 1s

°C/W

RJA

D Junction-to-Ambient, Natural Convection2

Four layer board - 2s2p

°C/W

RJMA

D Junction-to-Moving-Air, Ambient2

@200 ft./min., single layer

board - 1s

°C/W

RJMA

D Junction-to-Moving-Air, Ambient2

@200 ft./min., four layer

board - 2s2p

°C/W

RJB

D Junction-to-Board3

3 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC

specification for the specified package.

°C/W

RJCtop

D Junction-to-Case4

4 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate

temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.

5°C/W



D Junction-to-Package Top, Natural

Convection5

5 Thermal characterization parameter indicating the temperature difference between the package top and the

junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization

parameter is written as Psi-JT.

2°C/W

Table 11. Thermal characteristics for 208-pin MAPBGA1

1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.

Symbol

Parameter

Conditions

Value

Unit

RJA

D Junction-to-ambient, natural convection2,3

2 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site

(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board

thermal resistance.

3 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.

One layer board - 1s

°C/W

RJMA

D Junction-to-ambient natural convection2,4

4 Per JEDEC JESD51-6 with the board horizontal.

Four layer board - 2s2p

°C/W

RJA

D Junction-to-ambient (@200 ft/min)2,4

Single layer board

°C/W

RJMA

D Junction-to-ambient (@200 ft/min)2,4

Four layer board 2s2p

°C/W

RJB

D Junction-to-board5

Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is

measured on the top surface of the board near the package.

Four layer board - 2s2p

°C/W

RJC

D Junction-to-case6

6 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate

method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.

6°C/W



D Junction-to-package top natural convection7

2°C/W

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