MPC5633MMLL80 datasheet(70/106 Pages) FREESCALE

70 / 106 page

MPC5634M Microcontroller Data Sheet, Rev. 8

Freescale Semiconductor

The thermal resistance is expressed as the sum of a junction-to-case thermal resistance plus a case-to-ambient thermal

resistance:

RJA = RJC + RCA

Eqn. 3

where:

RJA = junction-to-ambient thermal resistance (oC/W)

RJC = junction-to-case thermal resistance (oC/W)

RCA = case to ambient thermal resistance (oC/W)

RJC is device related and is not affected by other factors. The thermal environment can be controlled to change the

case-to-ambient thermal resistance, RCA. For example, change the air flow around the device, add a heat sink, change the

mounting arrangement on the printed circuit board, or change the thermal dissipation on the printed circuit board surrounding

the device. This description is most useful for packages with heat sinks where 90% of the heat flow is through the case to heat

sink to ambient. For most packages, a better model is required.

A more accurate two-resistor thermal model can be constructed from the junction-to-board thermal resistance and the

junction-to-case thermal resistance. The junction-to-case thermal resistance describes when using a heat sink or where a

substantial amount of heat is dissipated from the top of the package. The junction-to-board thermal resistance describes the

thermal performance when most of the heat is conducted to the printed circuit board. This model can be used to generate simple

estimations and for computational fluid dynamics (CFD) thermal models.

To determine the junction temperature of the device in the application on a prototype board, use the thermal characterization

parameter (

JT) to determine the junction temperature by measuring the temperature at the top center of the package case using

the following equation:

TJ = TT + (JT x PD)

Eqn. 4

where:

TT = thermocouple temperature on top of the package (oC)

JT = thermal characterization parameter (oC/W)

PD = power dissipation in the package (W)

The thermal characterization parameter is measured in compliance with the JESD51-2 specification using a 40-gauge type T

thermocouple epoxied to the top center of the package case. Position the thermocouple so that the thermocouple junction rests

on the package. Place a small amount of epoxy on the thermocouple junction and approximately 1 mm of wire extending from

the junction. Place the thermocouple wire flat against the package case to avoid measurement errors caused by the cooling

effects of the thermocouple wire.

References:

Semiconductor Equipment and Materials International

3081 Zanker Road

San Jose, CA 95134

USA

(408) 943-6900

MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at 800-854-7179 or

303-397-7956.

JEDEC specifications are available on the web at http://www.jedec.org.

•

C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive Engine

Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47-54.

•

G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled Applications”, Electronic

Packaging and Production, pp. 53-58, March 1998.

MPC5633MMLL80 数据表(PDF) 70 Page - Freescale Semiconductor, Inc

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