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ADT7462ACPZ-R7 数据表(PDF) 41 Page - ON Semiconductor |
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ADT7462ACPZ-R7 数据表(HTML) 41 Page - ON Semiconductor |
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41 / 81 page ![]() ADT7462 http://onsemi.com 41 Figure 65. Chassis Airflow Issues FAN I/O CARDS POOR CPU AIRFLOW VENTS POWER SUPPLY CPU DRIVE BAYS GOOD VENTING = GOOD AIR EXCHANGE POOR VENTING = POOR AIR EXCHANGE VENTS FAN I/O CARDS GOOD CPU AIRFLOW FAN VENTS POWER SUPPLY CPU DRIVE BAYS • Worst−Case Processor Power Consumption This data sheet maximum does not necessarily reflect the true processor power consumption. Designing for worst−case CPU power consumption can result in a processor becoming over−cooled (generating excess system noise). • Worst−Case Peripheral Power Consumption The tendency is to design to data sheet maximums for peripheral components (again over−cooling the system). • Worst−Case Assembly Every system manufactured is unique because of manufacturing variations. Heat sinks may be loose fitting or slightly misaligned. Too much or too little thermal grease may be used. Variations in application pressure for thermal interface material can affect the efficiency of the thermal solution. Accounting for manufacturing variations in every system is difficult; therefore, the system must be designed for the worst−case. Figure 66. Thermal Model SUBSTRATE HEAT SINK THERMAL INTERFACE MATERIAL INTEGRATED HEAT SPREADER EPOXY THERMAL INTERFACE MATERIAL PROCESSOR TA TJ θCA θSA θTIMS θCTIM θTIMC θJTIM θCS TC TTIM TS TTIM θJA Although a design usually accounts for worst−case conditions in all these cases, the actual system is almost never operated at worst−case conditions. The alternative to designing for the worst case is to use the dynamic TMIN control function. Dynamic TMIN Control Overview Dynamic TMIN control mode builds upon the basic automatic fan control loop by adjusting the TMIN value based on system performance and measured temperature. This is important because, instead of designing for the worst case, the system thermals can be defined as operating zones. The ADT7462 can self−adjust its fan control loop to maintain either an operating zone temperature or a system target temperature. For example, it can be specified that ambient temperature in a system be maintained at 50 °C. If the temperature is below 50 °C, the fans might not need to run or might run very slowly. If the temperature is higher than 50 °C, the fans need to throttle up. The challenge presented by any thermal design is finding the right settings to suit the system’s fan control solution. This can involve designing for the worst case, followed by weeks of system thermal characterization and, finally, fan acoustic optimization (for psycho−acoustic reasons). Obtaining the greatest benefit from the automatic fan control mode involves characterizing the system to find the best TMIN and TRANGE settings for the control loop and the best PWMMIN value for the quietest fan speed setting. Using the ADT7462 dynamic TMIN control mode, however, shortens the characterization time and alleviates tweaking the control loop settings, because the device can self−adjust during system operation. Dynamic TMIN control mode is operated by specifying the operating zone temperatures required for the system. Remote 1 and Remote 2 channels have dedicated operating point registers. This allows the system thermal solution to be broken down into distinct thermal zones. For example, CPU operating temperature is 70 °C, VRM operating temperature is 80 °C, and ambient operating temperature is 50°C. The ADT7462 dynamically alters the control solution to maintain each zone temperature as close as possible to its target operating point. Figure 67 shows an overview of the parameters that affect the operation of the dynamic TMIN control loop. Figure 67. Dynamic TMIN Control Loop TLOW TMIN OPERATING POINT THIGH TRANGE TEMPERATURE TTHERM |
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