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PIC16F720-E/ML 数据表(PDF) 78 Page - Microchip Technology

部件名 PIC16F720-E/ML
功能描述  20-Pin Flash Microcontrollers with nanoWatt XLP Technology
PDF  244 Pages
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制造商  MICROCHIP [Microchip Technology]
网页  http://www.microchip.com
标志 MICROCHIP - Microchip Technology

PIC16F720-E/ML 数据表(HTML) 78 Page - Microchip Technology

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PIC16F/LF720/721
DS41430A-page 78
 2010 Microchip Technology Inc.
9.1
ADC Configuration
When configuring and using the ADC the following
functions must be considered:
• Port configuration
• Channel selection
• ADC conversion clock source
• Interrupt control
9.1.1
PORT CONFIGURATION
When converting analog signals, the I/O pin selected
as the input channel should be configured for analog by
setting the associated TRIS and ANSEL bits. Refer to
Section 6.0 “I/O Ports” for more information.
9.1.2
CHANNEL SELECTION
There are 14 channel selections available:
-AN<11:0> pins
- Temperature Indicator
- FVR (Fixed Voltage Reference) Output
Refer to Section 11.0 “Temperature Indicator Mod-
ule” and Section 10.0 “Fixed Voltage Reference” for
more information on these channel selections.
The CHS bits of the ADCON0 register determine which
channel is connected to the sample and hold circuit.
When changing channels, a delay is required before
starting the next conversion. Refer to Section 9.2
“ADC Operation” for more information.
9.1.3
CONVERSION CLOCK
The source of the conversion clock is software
selectable via the ADCS bits of the ADCON1 register.
There are seven possible clock options:
•FOSC/2
•FOSC/4
•FOSC/8
•FOSC/16
•FOSC/32
•FOSC/64
•FRC (dedicated internal oscillator)
The time to complete one bit conversion is defined as
TAD. One full 8-bit conversion requires 10 TAD periods
as shown in Figure 9-2.
For
correct
conversion,
the
appropriate
TAD
specification must be met. Refer to the A/D conversion
requirements
in
Section 23.0
“Electrical
Specifications” for more information. Table 9-1 gives
examples of appropriate ADC clock selections.
Note:
Analog voltages on any pin that is defined
as a digital input may cause the input buf-
fer to conduct excess current.
Note:
Unless using the FRC, any changes in the
system clock frequency will change the
ADC
clock
frequency,
which
may
adversely affect the ADC result.
TABLE 9-1:
ADC CLOCK PERIOD (TAD) VS. DEVICE OPERATING FREQUENCIES
ADC Clock Period (TAD)
Device Frequency (FOSC)
ADC
Clock Source
ADCS<2:0>
16 MHz
8 MHz
4 MHz
1 MHz
FOSC/2
000
125 ns(2)
250 ns(2)
500 ns(2)
2.0
s
FOSC/4
100
250 ns(2)
500 ns(2)
1.0
s4.0 s
FOSC/8
001
0.5
s(2)
1.0
s2.0 s8 s(5)
FOSC/16
101
1.0
s2.0 s4.0 s16.0 s(5)
FOSC/32
010
2.0
s4.0 s8 s(5)
32.0
s(3)
FOSC/64
110
4.0
s8 s(5)
16.0
s(5)
64.0
s(3)
FRC
x11
1.0-6.0
s(1,4)
1.0-6.0
s(1,4)
1.0-6.0
s(1,4)
1.0-6.0
s(1,4)
Legend: Shaded cells are outside of recommended range.
Note 1:
The FRC source has a typical TAD time of 1.6
s for VDD.
2:
These values violate the minimum required TAD time.
3:
For faster conversion times, the selection of another clock source is recommended.
4:
When the device frequency is greater than 1 MHz, the FRC clock source is only recommended if the
conversion will be performed during Sleep.
5:
Recommended values for VDD
 2.0V and temperature -40°C to 85°C. The 16.0 s setting should be
avoided for temperature > 85°C.



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