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LSM330DL 数据表(PDF) 1 Page - STMicroelectronics |
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LSM330DL 数据表(HTML) 1 Page - STMicroelectronics |
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1 / 54 page  Preliminary data This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. July 2011 Doc ID 022018 Rev 1 1/54 54 LSM330DL Linear sensor module 3D accelerometer sensor and 3D gyroscope sensor Features ■ Analog supply voltage 2.4 V to 3.6 V ■ Digital supply voltage I/Os, 1.8V ■ Low-power mode ■ Power-down mode ■ 3 independent acceleration channels and 3 angular rate channels ■ ±2g/±4g/±8g/±16g dynamic, selectable full- scale acceleration range ■ ±250/±500/±2000 dps dynamic, selectable full- scale angular rate ■ SPI/I2C serial interface (16-bit data output) ■ Programmable interrupt generator for free-fall and motion detection ■ ECOPACK®, RoHS, and “Green” compliant Applications ■ GPS navigation systems ■ Impact recognition and logging ■ Gaming and virtual reality input devices ■ Motion-activated functions ■ Intelligent power saving for handheld devices ■ Vibration monitoring and compensation ■ Free-fall detection ■ 6D-orientation detection Description The LSM330DL is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope. ST’s family of modules leverages a robust and mature manufacturing process already used for the production of micromachined accelerometers. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are based on CMOS technology that allows designing a dedicated circuit which is trimmed to better match the sensing element characteristics. The LSM330DL has a dynamic, user-selectable full-scale acceleration range of ±2 g/±4g/±8g/±16g and an angular rate of ±250/±500/±2000 deg/sec. The accelerometer and gyroscope sensors can be either activated or put in low-power / power- down mode separately for power-saving optimized applications. The LSM330DL is available in a plastic land grid array (LGA) package. Several years ago ST successfully pioneered the use of this package for accelerometers. Today, ST has the broadest manufacturing capability in the world and unrivalled expertise for the production of sensors in a plastic LGA package. LLGA 28L 7.5 x 4.4 x 1.1 mm Table 1. Device summary Part number Temperature range [°C] Package Packing LSM330DL -40 to +85 LGA-28 Tray LSM330DLTR -40 to +85 LGA-28 Tape & reel www.st.com |
类似零件编号 - LSM330DL |
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类似说明 - LSM330DL |
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