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LSM330DL 数据表(PDF) 19 Page - STMicroelectronics |
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LSM330DL 数据表(HTML) 19 Page - STMicroelectronics |
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19 / 54 page ![]() LSM330DL Application hints Doc ID 022018 Rev 1 19/54 4 Application hints Figure 5. LSM330DL electrical connections 4.1 External capacitors The device core is supplied through the Vdd line. Power supply decoupling capacitors (C4=100 nF ceramic, C3=10 µF Al) should be placed as near as possible to the supply pin of the device (common design practice). All the voltage and ground supplies must be present at the same time to have proper behavior of the IC (refer to Figure 5). The functionality of the device and the measured acceleration/angular rate data is selectable and accessible through the SPI/I2C interface. Table 9. Part list Component Typical value C1 10 nF C2 470 nF C3 10 µF C4 100 nF C5 R2 10 kOhm Digital signal from/to signal controller.Signals levels are defined by proper selection of Vdd Y 1 X Z DIRECTION OF DETECTABLE ACCELERATIONS DIRECTION OF DETECTABLE ANGULAR RATE Vdd_IO GND Vdd C3 C4 FILTVDD FILTIN Y (TOP VIEW) 24 1 LSM330DL 28 10 15 11 14 25 Vdd_IO_A VCONT Res GND Res SCL_G Vdd_IO_G Res Vdd_IO C1 R2 C2 GND C5 GND Reserved pins have to be connected to GND Z 1 +Ω X +Ω z +Ω Y Y X AM09287v1 |
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