LSM9DS0 datasheet(71/74 Pages) STMICROELECTRONICS

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LSM9DS0

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK is an ST trademark.

Note:

1. Dimensioning and tolerancing schemes conform to ASME Y14.5M-1994.

2. All dimensions are in millimeters.

3. The “Pin 1 Indicator” is identified on top and/or bottom surfaces of the package.

4. A1 is defined as the distance from the seating plane to the land.

5. “N” is the maximum number of terminal positions for the specified body size.

6. The tolerance of the typical value is specified in table "Tolerance of Form and Position".

7. Dimensions “b” and “L” are specified:

For solder mask defined: at terminal plating surface

For non-solder mask defined: at solder mask opening

Table 133. LGA 4x4x1 mm 24-lead mechanical data (see note 1 and 2)

Databook

Symbol

Min.

Typ.

Max.

Note

1.070

0.000

0.050

0.200

4.000

1.750

4.000

1.750

0.500

2.500

0.350

0.100

N24

0.080

Symbol

Tolerance of Form and Position

Databook

D/E

0.15

Notes

1 and 2

REF

LSM9DS0 数据表(PDF) 71 Page - STMicroelectronics

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